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US 11,584,109 B2Granted
Poly-supported copper foil
AssigneeAdvanced Copper Foil Inc.
InventorKieran Healy
Life of this patent
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Abstract
A supported copper foil is disclosed, comprising: a poly-based film that contains polyimide and polytetrafluoroethylene; a thin copper foil; and an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.
Claims9
A supported copper foil comprising:
- a poly-based film that contains polyimide, polytetrafluoroethylene, and diphosphene filler particles;
- a thin copper foil;
- and
- an adhesive provided between the poly-based film and the thin copper foil, the adhesive removably coupling the poly-based film to the copper foil.
1 more element
Dependencies are inferred from the claim text.