Component mounting machine

A component mounting machine comprising:

• a component transfer device, having a component mounting tool configured to collect and mount a component, a mounting head configured to hold the component mounting tool, and a head driving mechanism configured to horizontally drive the mounting head, which performs a mounting work of mounting the component collected from a component supply device on a predetermined coordinate position of a board carried in and positioned by a board conveyance device, and
• a control device including a processor configured to control the mounting work, and configured to implement a thermal correction process for reducing an influence on mounting accuracy of the component, of which the influence being caused by thermal deformation due to a temperature change in at least one of the head driving mechanism and the mounting head,
• wherein the control device is configured to:
• acquire an accuracy requirement level indicating a required level of the mounting accuracy based on at least one of a type of component to be mounted and the mounting work, the accuracy requirement level being one of low, middle or high,
• acquire a thermal influence level indicating a level of the influence of the thermal deformation on the mounting accuracy based on a work continuation time in which the mounting work continues from start of the mounting work to finish of the mounting work or from termination of a previous thermal correction process and to restart the mounting work after the previous thermal correction process to finish the mounting work, and a temperature rise characteristic of at least one of the head driving mechanism and the mounting head, the thermal influence level being one of non-influence, small, middle or large,
• determine an implementation timing of the thermal correction process based on the accuracy-requirement level and the thermal influence level, and
• implement the thermal correction process according to the determined implementation timing in a time period between a mounting operation and a next picking up operation of the component mounting tool or in a time period between the board conveyance device carrying out the board of which mounting work is terminated and carrying in a next board.