Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component

A resin comprising structural units represented by the following general formulas (2) and (3):

• wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms that is optionally substituted with a heteroatom and optionally has an intervening heteroatom;
• X1 to X3 represent any of —CO2—, —CONRX1—, —O—, —NRx1—, —S—, —SO2—, —SO3— and —SO2NRx1— and may be the same as or different from each other, provided that RX1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms that is optionally substituted with a heteroatom and optionally has an intervening heteroatom;
• Ar represents a divalent aromatic group having 2 to 30 carbon atoms that is optionally substituted with a heteroatom and optionally has an intervening heteroatom;
• L1 and L2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms that is optionally substituted with a heteroatom and optionally has an intervening heteroatom;
• x and y are each independently 0 or 1;
• and Y1 represents a tetravalent hydrocarbon group having 1 to 100 carbon atoms that is optionally substituted with a heteroatom and optionally has an intervening heteroatom.