Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding

A method comprising:

• irradiating an interface between a first substrate and a second substrate with laser energy;
• and
• locally heating surfaces of the first substrate and the second substrate proximate the interface with the laser energy, thereby fusing the first substrate and the second substrate at the interface;
• wherein the locally heating the surfaces of the first substrate and the second substrate proximate the interface with the laser energy forms a plasma at the interface and softens at least one of the first substrate or the second substrate without melting the first substrate and the second substrate;
• wherein the interface comprises a heat absorption layer disposed between the first substrate and the second substrate, and the heat absorption layer comprises a metal material;
• and
• wherein the irradiating the interface comprises adjusting a pulse length of the laser energy such that undiffused metal material remaining within a bond line formed between the first substrate and the second substrate forms a conductive trace.