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US 11,570,939 B2Granted
Lead cutting system
AssigneeFuji Corporation
InventorKazuya Degura
Life of this patent
Estimating the term…
Abstract
A lead-cutting system, comprising: a rotation device configured to rotate a rotary table; a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component inserted into through-holes in a board; and a container, being disposed on the rotary table together with the cutting device, which contains leads cut by the cutting device.
Claims5
A lead-cutting system, comprising:
- a rotary table configured to rotate;
- a cutting device, being disposed on the rotary table, which is configured to cut leads of a lead component that is inserted into through-holes in a board;
- a container, being disposed on the rotary table together with the cutting device, which contains the leads cut by the cutting device;
- and
- a Z-direction moving device configured to move the rotary table in a vertical direction,
- wherein the container comprises
- an opening for receiving leads cut by the cutting device therein,
- a shielding plate extending toward a side wall of the container so as to block the opening, and
- an inclined plate disposed obliquely above the shielding plate.
6 more elements
Dependencies are inferred from the claim text.