Method for manufacturing aluminum circuit board

A method for manufacturing an aluminum circuit board, comprising:

• a step of spraying heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and thereby forming a metal layer on a surface of the ceramic base material,
• wherein in a case where the metal powder is sprayed to the ceramic base material by being heated and accelerated by the warm spraying method, in the mass-based cumulative particle diameter distribution of the metal powder, the particle diameter D10 is greater than or equal to 10 μm, and the particle diameter D90 is less than or equal to 50 μm,
• in the metal powder that is sprayed to the ceramic base material, the ratio of the metal powder of which temperature at a time point of reaching the surface of the ceramic base material is lower than 450° C. of the metal powder is less than or equal to 10 mass %, and the ratio of the metal powder of which temperature at the time point of reaching the surface of the ceramic base material is higher than the melting point of the metal powder is less than or equal to 10 mass %, and the temperature of the rest of the metal powder at the time point of reaching the surface of the ceramic base material is higher than or equal to 450° C. of the metal powder and lower than or equal to the melting point of the metal powder, and the velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

An aluminum circuit board, comprising:

• a ceramic base material;
• and
• a metal layer formed by performing film formation of metal powder containing aluminum particles and/or an aluminum alloy particles on a surface of the ceramic base material, wherein the temperature of at least a part of the metal powder is higher than or equal to 450° C. and lower than or equal to the melting point of the metal powder at a time point of reaching the surface of the ceramic base material by the warm spraying method,
• wherein an electric resistivity of the metal layer is less than or equal to 4×10−8 Ωm.