Wetting layers for optical device enhancement
AssigneeApplied Materials, Inc.
InventorsKarl J. Armstrong, Jinxin Fu, Wilson Banez
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Abstract
Embodiments described herein relate to methods and materials for optical device fabrication. In one embodiment, a method of fabricating an optical device is provided. The method includes depositing a dielectric film on a substrate, depositing a wetting layer on the dielectric film, and depositing a metal containing film on the wetting layer. In another embodiment, an optical device is provided. The device includes a substrate, a dielectric film deposited on and contacting the substrate, a wetting layer deposited on and contacting the dielectric film, and a metal containing film deposited on and contacting the wetting layer.
Claims14
A method of fabricating an optical device, comprising:
- heating a substrate;
- depositing a dielectric film on and in contact with the substrate, the dielectric film formed of an oxide-containing material and having a thickness between about 2 nm and about 8 nm;
- depositing a first wetting layer on and in contact with the dielectric film, the first wetting layer comprising a metal selected from the group consisting of titanium, chromium, cobalt, and nickel;
- depositing a metal-containing film on and in contact with the first wetting layer, the metal-containing film formed of a reflective metallic material comprising one or more of aluminum, silver, and gold;
- and
- depositing a second wetting layer on and in contact with the metal-containing film, the second wetting layer comprising a dielectric material selected from the group consisting of silicon, silicon oxide, tantalum oxide, aluminum oxide, gallium phosphide, and gallium nitride.
A method of fabricating an optical device, comprising:
- heating a substrate;
- depositing a dielectric layer on and in contact with the substrate, the dielectric layer formed of an oxide-containing material selected from the group consisting of titanium dioxide, hafnium oxide, zirconium oxide, lanthanum oxide, and aluminum oxide, the dielectric layer having a thickness between about 2 nm and about 8 nm;
- depositing a first wetting layer on and in contact with the dielectric layer, the first wetting layer comprising a metal selected from the group consisting of titanium, chromium, cobalt, and nickel;
- depositing a metal-containing film on and in contact with the first wetting layer, the metal-containing film formed of a reflective metallic material comprising one or more of aluminum, silver, and gold;
- and
- depositing a second wetting layer on and in contact with the metal layer, the second wetting layer comprising a dielectric material selected from the group consisting of silicon, silicon oxide, tantalum oxide, aluminum oxide, gallium phosphide, and gallium nitride.
A method of fabricating an optical device, comprising:
- depositing a first dielectric layer over and in contact with a surface of a substrate via physical vapor deposition, the first dielectric layer comprising titanium oxide and having a thickness between about 2 nm and about 8 nm;
- depositing a first metal layer over and in contact with the titanium oxide layer, the first metal layer consisting of titanium, chromium, cobalt, or nickel;
- forming a second metal layer over the first metal layer, the metal layer comprising one or more of aluminum, silver, and gold;
- and
- depositing a second dielectric layer over the second metal layer, the second dielectric layer consisting of silicon or silicon oxide.
Dependencies are inferred from the claim text.