Injection molding apparatus and method
AssigneeSeiko Epson Corporation
InventorsHidenobu Maruyama, Kenta Anegawa
Life of this patent
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AssigneeSeiko Epson Corporation
InventorsHidenobu Maruyama, Kenta Anegawa
Estimating the term…
An injection molding apparatus includes a plasticizing portion, a measurement injection portion that is disposed between the plasticizing portion and a molding mold, measures the plasticized material, and injects the measured plasticized material into the molding mold, a first drive portion changing a relative position between the plasticizing portion and the measurement injection portion, a pressure detection portion detecting a pressure inside the measurement injection portion and a control portion, in which the measurement injection portion is configured such that a volume of an internal space thereof, in which the plasticized material is stored, changes according to a change in the relative position between the measurement injection portion and the plasticizing portion, and the control portion executes at least one of a measurement operation of causing the measurement injection portion to measure the plasticized material by controlling the first drive portion to move the plasticizing portion and the measurement injection portion in a direction away from each other, and an injection operation of injecting the measured plasticized material into the molding mold by controlling the first drive portion to move the plasticizing portion and the measurement injection portion in a direction approaching each other depending on the pressure.
An injection molding apparatus comprising:
A method executed by an injection molding apparatus that includes
Dependencies are inferred from the claim text.