Systems and methods for forming semiconductor cutting/trimming blades
AssigneeMicron Technology, Inc.
InventorJonathan S. Hacker
Life of this patent
Estimating the term…
Abstract
A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.
Claims9
A method of manufacturing or maintaining a semiconductor dicing or grinding blade, the method comprising:
- moving a blade into contact with a grinding surface of a dressing board, the blade comprising:
- an axis of rotation;
- an annular cutting surface configured to rotate about the axis of rotation;
- and
- a blade body extending between the axis of rotation and the annular cutting surface;
- and
- rotating the annular cutting surface about the axis of rotation while the blade is in contact with the grinding surface of the dressing board, wherein rotation of the annular cutting surface causes the grinding surface of the dressing board to shape the annular cutting surface to a desired shape;
- wherein at least a portion of a cross-section of the desired shape, as taken on a cutting plane parallel to the axis of rotation of the blade, is concave and is not parallel to the axis of rotation of the blade.
Dependencies are inferred from the claim text.