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US 11,565,312 B2Granted
Surface-treated metal powder and conductive composition
AssigneeJX Nippon Mining & Metals Corporation
InventorHideki Furusawa
Life of this patent
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Abstract
There is provided a more versatile technique that is useful for enhancing the sintering delay property of a metal powder. A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al or Zr, wherein a total adhesion amount of Si, Ti, Al and Zr is 200 to 10,000 μg with respect to 1 g of the surface-treated metal powder, wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and wherein a sintering starting temperature is 500° C. or higher.
Claims13
A metal powder surface-treated with at least one coupling agent comprising Si, Ti, Al, or Zr,
- wherein a total adhesion amount of Si, Ti, Al, and Zr is 200 μg to 10,000 μg with respect to 1 g of the surface-treated metal powder,
- wherein a 1% by mass aqueous solution of the coupling agent indicates a pH of 7 or less, and the coupling agent is pretreated to promote a self-condensation reaction by mixing the coupling agent with an alkaline aqueous solution having a pH of 11.5 to 13.5 before surface-treating the metal powder, such that a plurality of oxide layers derived from the coupling agent is formed on a surface of the metal powder, and
- wherein a sintering starting temperature is 500° C. or higher.
Dependencies are inferred from the claim text.