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US 11,564,331 B2Granted
Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods
AssigneeMicron Technology, Inc.
InventorMark E. Tuttle
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes functional circuits electrically coupled to each other and each coupled to a different thermal circuit. The different thermal circuits are configured to maintain different operating temperatures targeted for each corresponding functional circuit. One of the thermal circuits may use a cryogenic liquid to cool the corresponding functional circuit.
Claims17
A method of manufacturing an electronic device, comprising:
- providing a substrate;
- attaching a first functional circuit to the substrate, the first functional circuit configured to process data;
- attaching a second functional circuit to the substrate, the second functional circuit configured to store data;
- thermally coupling a first thermal circuit to the first functional circuit, the first functional circuit configured to utilize cooling liquid to cool the first functional circuit, wherein the cooling liquid is a cryogenic liquid having a boiling point less than or equal to −150° C.;
- and
- thermally coupling a second thermal circuit to the second functional circuit, the second thermal circuit configured to cool the second functional circuit without using the cooling liquid,
- wherein:
- the first thermal circuit includes an enclosure configured to contain the cryogenic liquid;
- the substrate includes thermal isolation material;
- and
- thermally coupling the first thermal circuit includes enclosing the first functional circuit with the enclosure, wherein (1) the cryogenic liquid directly contacts the first functional circuit and (2) enclosing the first functional circuit with the enclosure includes:
- attaching the first functional circuit over the thermal isolation material, and
- attaching the enclosure over the thermal isolation material.
10 more elements
An electronic device, comprising:
- a first functional circuit;
- a first thermal circuit configured to manage a first operating temperature of the first functional circuit based on surrounding the first function circuit with a cryogenic liquid having a boiling point that is equal to or less than −150° C.;
- a second functional circuit electrically coupled to the first function circuit;
- a second thermal circuit configured to manage a second operating temperature of the second functional circuit, wherein the second operating temperature is higher than the first operating temperature;
- and
- a substrate having the first and second functional circuits attached thereon;
- wherein:
- the first thermal circuit includes an enclosure configured to contain the cryogenic liquid;
- the substrate includes thermal isolation material;
- and
- the first functional circuit is enclosed within the enclosure,
- wherein the cryogenic liquid directly contacts the first functional circuit,
- wherein the first functional circuit is attached over the thermal isolation material, and
- wherein the enclosure is attached over the thermal isolation material.
11 more elements
A method of operating an electronic device, comprising:
- processing data using a first functional circuit and a second functional circuit;
- managing a first operating temperature for the first functional circuit with a cryogenic liquid having a boiling point less than a predefined threshold;
- and
- managing a second operating temperature for the second functional circuit, wherein the second operating temperature is higher than the first operating temperature;
- wherein:
- the first and second functional circuits are attached on a substrate that includes a thermal isolation material;
- the first thermal circuit includes an enclosure configured to contain the cryogenic liquid;
- and
- the first functional circuit is enclosed within the enclosure,
- wherein the cryogenic liquid directly contacts the first functional circuit,
- wherein the first functional circuit is attached over the thermal isolation material, and
- wherein the enclosure is attached over the thermal isolation material.
9 more elements
Dependencies are inferred from the claim text.