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US 11,563,136 B2Granted
System and methods for managing heat in a photonic integrated circuit
AssigneeAcacia Communications, Inc.
InventorJohn Heanue
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Abstract
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
Claims9
A system, comprising:
- a photonic integrated circuit (PIC) assembly, comprising:
- a PIC comprising:
- a first bond pad disposed inward from an edge of the PIC a first distance;
- and
- a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than about 0.4 mm.
2 more elements
Dependencies are inferred from the claim text.