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US 11,552,053 B2Granted
Miniaturization of optical sensor modules through wirebonded ball stacks
AssigneeApple Inc.
InventorsBilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Praveesh Chandran
Life of this patent
Estimating the term…
Abstract
Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.
Claims19
An optical sensor module comprising:
- a module substrate including a landing pad;
- an optical component mounted on the landing pad;
- a pillar of stacked wireballs adjacent the optical component;
- a molding compound layer laterally surrounding the pillar and the optical component on the module substrate;
- and
- a metal wire that is looped above a top surface of the molding compound layer and connecting the pillar and a top electrode pad of the optical component.
3 more elements
An optical sensor module comprising:
- a module substrate including a landing pad;
- a photodetector (PD) mounted on the landing pad;
- an emitter mounted on a second landing pad of the module substrate;
- a pillar of stacked wireballs adjacent the PD;
- a second pillar of stacked wireballs adjacent the emitter;
- a molding compound layer laterally surrounding the pillar, the second pillar, and the PD, and the emitter on the module substrate;
- a wiring layer over the molding compound layer and connecting the pillar and a top electrode pad of the PD;
- and
- a second wiring layer over the molding compound layer and connecting the second pillar and a second top electrode pad of the emitter.
6 more elements
An optical sensor module comprising:
- a module substrate including a landing pad;
- an optical component mounted on the landing pad;
- a pillar of stacked wireballs adjacent the optical component;
- wherein a lateral stand-off distance between the pillar and the optical component is less than 30 μm;
- a molding compound layer laterally surrounding the pillar and the optical component on the module substrate;
- and
- a wiring layer over the molding compound layer and connecting the pillar and a top electrode pad of the optical component.
4 more elements
An optical sensor module comprising:
- a module substrate including a landing pad and an embedded controller chip;
- an optical component mounted on the landing pad;
- a pillar of stacked wireballs adjacent the optical component;
- a molding compound layer laterally surrounding the pillar and the optical component on the module substrate;
- and
- a wiring layer over the molding compound layer and connecting the pillar and a top electrode pad of the optical component.
3 more elements
Dependencies are inferred from the claim text.