Micro device transfer head assembly
AssigneeApple Inc.
InventorsAndreas Bibi, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Claims20
A micro device transfer head comprising:
- a base substrate;
- a mesa structure protruding away from the base substrate, wherein the mesa structure includes a top surface and sidewalls;
- wherein the top surface of the mesa structure has x-y dimensions, each x dimension and y dimension of 1 to 100 μm;
- a passivation layer covering the top surface and the sidewalls of the mesa structure;
- and
- a patterned conductive layer spanning over the passivation layer and the top surface of the mesa structure.
A micro device transfer head array comprising:
- an array of transfer heads, each transfer head including a mesa structure protruding away from a base substrate, wherein each mesa structure includes a top surface and sidewalls;
- wherein the top surface has x-y dimensions, each x dimension and y dimension of 1 to 100 μm;
- a passivation layer covering the top surface and the sidewalls of each mesa structure;
- and
- a patterned conductive layer spanning over the passivation layer and the top surface of each mesa structure.
Dependencies are inferred from the claim text.