Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and nitrogen-containing aromatic heterocyclic compound

A chemically amplified positive-type photosensitive resin composition comprising an acid generator (A) which generates acid upon exposure to an irradiated active ray or radiation, a resin (B) whose solubility in alkali increases under an action of acid, and a nitrogen-containing aromatic heterocyclic compound (C), wherein

• the nitrogen-containing aromatic heterocyclic compound (C) is a compound represented by the following formula (c1):
• (Y1-A2)k—R1 (c1)
• wherein in the formula (c1), Y1 is a group represented by the formula (c-a-1):
• A1 is a single bond or a divalent group selected from a group consisting of —O—, —CO—, —COO—, —OCO—, —OCOO—, —NH—, —CONH—, —NHCO—, —NHCONH—, —S—, —SO—, and —SO2—;
• R1 is a hydrogen atom or a k-valent organic group:
• k is 1 or 2, when k is 2, two Y1-A2 - may be identical to or different from each other, and when R1 is a hydrogen atom, k is 1;
• in the formula (c-a-1), Sub is a substituent, AC1 is a pyridine ring, where two Subs may be identical to or different from each other
• wherein a common logarithm value Log S of the solubility S of the nitrogen-containing aromatic heterocyclic compound (C) is -6.00 or less.