Backlight module and method of manufacturing the same

A method of manufacturing a backlight module, comprising:

• disposing a circuit board under a light guide plate, wherein the circuit board comprises a first substrate and a conductive layer, and the light guide plate has a first hole;
• forming a through hole on the conductive layer;
• disposing a first reflective layer disposed between the light guide plate and the circuit board to make the first substrate be at least partially in contact with the first reflective layer and make the conductive layer be disposed between the first substrate and the first reflective layer, wherein the first reflective layer has a second hole corresponding to the first hole;
• forming a recess on the first reflective layer to be recessed into the through hole;
• disposing a light source on the circuit board to be accommodated in the first hole and the second hole, so that the light source is in contact with the conductive layer;
• and
• disposing a cover plate over the light guide plate, wherein the cover plate has a light-shielding region corresponding to the first hole.