Dielectric substrate and method of forming the same
AssigneeSaint-Gobain Performance Plastics Corporation
InventorsJennifer Adamchuk, Dale Thomas, Meghann White, Sethumadhavan Ravichandran, Gerard T. Buss
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Abstract
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
Claims20
A dielectric substrate comprising:
- a polymer based core film, and
- a fluoropolymer based adhesive layer,
- wherein the polymer based core film comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material, and
- wherein a particle size distribution of the first filler material comprises:
- a D10 of at least about 0.5 microns and not greater than about 1.6 microns,
- a D50 of at least about 0.8 microns and not greater than about 2.7 microns, and
- a D90 of at least about 1.5 microns and not greater than about 4.7 microns.
A copper-clad laminate comprising:
- a copper foil layer, and a dielectric substrate overlying the copper foil layer,
- wherein the dielectric substrate comprises:
- a polymer based core film, and
- a fluoropolymer based adhesive layer,
- wherein the polymer based core film comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material, and
- wherein a particle size distribution of the first filler material comprises:
- a D10 of at least about 0.5 microns and not greater than about 1.6 microns,
- a D50 of at least about 0.8 microns and not greater than about 2.7 microns, and
- a D90 of at least about 1.5 microns and not greater than about 4.7 microns.
A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
- a copper foil layer, and a dielectric substrate overlying the copper foil layer,
- wherein the dielectric substrate comprises:
- a polymer based core film, and
- a fluoropolymer based adhesive layer,
- wherein the polymer based core film comprises:
- a resin matrix component;
- and
- a ceramic filler component,
- wherein the ceramic filler component comprises a first filler material, and
- wherein a particle size distribution of the first filler material comprises:
- a D10 of at least about 0.5 microns and not greater than about 1.6 microns,
- a D50 of at least about 0.8 microns and not greater than about 2.7 microns, and
- a D90 of at least about 1.5 microns and not greater than about 4.7 microns.
Dependencies are inferred from the claim text.