Light- or heat-curing method and curable resin composition
AssigneeFujifilm Wako Pure Chemical Corporation
InventorsTadashi Nakano, Nobuhiko Sakai, Kosuke Yanaba, Shigeaki Imazeki
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AssigneeFujifilm Wako Pure Chemical Corporation
InventorsTadashi Nakano, Nobuhiko Sakai, Kosuke Yanaba, Shigeaki Imazeki
Estimating the term…
An object of the present invention is to provide a light- or heat-curing method by which a cured product (crosslinked product or resin) can be prepared in a simple method even in a case where filler is contained in a large amount; a curable resin composition which is used in the curing method; and the like. The present invention provides a light- or heat-curing method containing a step 1 of obtaining (E) a condensate having constitutional units of Si—O—Al and/or Si—O—Si, obtained from aluminum derived from an aluminum alkoxide and a silane derived from a silane coupling agent having a mercapto group, from (A) a compound that is formed of a salt of a carboxylic acid and an amine and has a carbonyl group generating a radical and a carboxylate group generating a base through decarboxylation by irradiation with light or heating, the (B) aluminum alkoxide, the (C) silane coupling agent having a mercapto group, and (D) water, and a step 2 of performing a reaction among the (E) condensate, (H) a compound having two or more polymerizable unsaturated groups, and (I) filler under the conditions of irradiation with light or heating in the presence of the (A) compound; a curable resin composition which is used in the curing method; and the like.
A light- or heat-curing method comprising:
A light- or heat-curing method comprising:
A curable resin composition comprising:
A curable resin composition comprising:
Dependencies are inferred from the claim text.