Anisotropic conductive film (ACF) structure and hot-pressing method and hot-pressing assembly thereof
AssigneeJiangsu Telilan Coaling Technology Co., Ltd.
InventorsLiang Zheng, Zheng Xu, Shuibing Yan
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AssigneeJiangsu Telilan Coaling Technology Co., Ltd.
InventorsLiang Zheng, Zheng Xu, Shuibing Yan
Estimating the term…
An anisotropic conductive film (ACF) structure and a hot-pressing method and a hot-pressing assembly thereof are provided. The ACF structure includes an ACF and a copper/gold foil surface layer as a substrate. The ACF structure is hot-pressed by a hot-pressing method, which includes the following steps: allowing, when the ACF is in a molten state, the copper/gold foil surface layer and a bonded part to be conductive respectively to generate a magnetic field around to enhance the attraction of the copper/gold foil surface layer and the bonded part to conductive particles inside the ACF; and applying, when the ACF is in a curing stage, a closed circuit to ends of the copper/gold foil surface layer and the bonded part to perform real-time detection on the ACF to ensure the effectiveness of the hot pressing.
An anisotropic conductive film (ACF) structure consisting of of an ACF, conductive particles in the ACF, and a copper/gold foil surface layer as a substrate, wherein the ACF is coated on the copper/gold foil surface layer;
Dependencies are inferred from the claim text.