High-frequency dielectric heating adhesive sheet, and adhesion method in which same is used

An adhesion method of a high-frequency dielectric heating adhesive sheet, the high-frequency dielectric heating adhesive sheet comprising:

• a sheet-shaped base material;
• a high-frequency dielectric adhesive layer;
• and
• a decorative layer provided on an upper side of the sheet-shaped base material, wherein the high-frequency dielectric adhesive layer comprises:
• at least one thermoplastic resin as a component A;
• and a dielectric filler as a component B,
• the component B is a single one or a combination of zinc oxide and silicon carbide (SiC), a mean particle size of the component B measured according to JIS Z 8819-2 (2001) is a value in a range from 1 to 30 μm,
• a content of the component B is in a range from 69 parts by mass to 800 parts by mass relative to 100 parts by mass of the component A, and
• the high-frequency dielectric adhesive layer satisfies a condition (ii) as follows:
• (ii) a melting point or a softening point measured by a method according to JIS K 7121 (1987) is a value in a range from 80 to 200 degrees C. and a dielectric property (tan δ/ε′) obtained by dividing dissipation factor (tan δ) by relative permittivity (ε′) is 0.005 or more,
• the adhesion method comprising:
• (1) forming the high-frequency dielectric adhesive layer and the decorative layer on the sheet-shaped base material to prepare the high-frequency dielectric heating adhesive sheet;
• and
• (2) subjecting the high-frequency dielectric heating adhesive sheet to high-frequency dielectric heating to adhere on an adherend.