Composition for forming resist underlayer film and method for forming resist pattern using same
AssigneeNissan Chemical Industries, Ltd.
InventorsHiroto Ogata, Yuki Usui, Mamoru Tamura, Takahiro Kishioka
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Abstract
A method includes applying a composition for forming a resist underlayer film to a substrate having a recess in a surface, and baking the composition for forming a resist underlayer film to form a resist underlayer film for filling at least the recess. The composition for forming a resist underlayer film has a copolymer having a structural unit of following formula (1), a cross-linkable compound, a cross-linking catalyst, and a solvent: wherein R1 and R2 are each independently a C1-3 alkylene group or a single bond, Z is an —O— group, a —S— group, or a —S—S— group, and Ar is an arylene group.
Claims3
A method comprising steps of:
- applying a composition for forming a resist underlayer film to a substrate having a recess in a surface;
- and
- baking the composition for forming a resist underlayer film to form a resist underlayer film for filling at least the recess,
- wherein the composition for forming the resist underlayer film comprises
- a copolymer having a structural unit of the following formula (1):
- wherein R1 and R2 are each independently a C1-3 alkylene group or a single bond, Z is an —O— group, a —S— group, or a —S—S— group, and Ar is a naphthylene group having no substitutions,
- a cross-linkable compound,
- a cross-linking catalyst, and
- a solvent.
Dependencies are inferred from the claim text.