Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

A substrate processing system, comprising:

• a chamber;
• a robot disposed in the chamber;
• and
• a robot arm connected to the robot, the robot arm comprising:
• an end effector body;
• a replaceable contact pad disposed on the end effector body, the replaceable contact pad comprising a contact pad head having a contact surface configured to contact a substrate, and a shaft coupled to the contact pad head and received in an aperture formed in the body of the end effector and extending into a recess;
• and
• a coating deposited on a surface of the end effector body and on the contact surface of the contact pad head, the coating comprising an electrically-dissipative material, wherein the electrically-dissipative material is to provide a dissipative path from the coating to ground, and wherein the coating is uniform and conformal.