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AssigneeHRL Laboratories, LLC
InventorsPeter Brewer, Aurelio Lopez, Pamela R. Patterson
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A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.
A method of bonding a double-ended cable, including a first head, a second head, and a ribbon cable between the first head and the second head, to a multi-tier substrate, including a first substrate and a second substrate stacked on the first substrate, the method comprising:
A system for bonding a double-ended cable, including a first head, a second head, and a ribbon cable between the first head and the second head, to a multi-tier substrate, including a first substrate and a second substrate stacked on the first substrate, the system comprising:
A method of bonding a double-ended cable, including a first head, a second head, and a ribbon cable between the first head and the second head to a multi-tier substrate including a first substrate and a second substrate stacked on the first substrate, the method comprising:
Dependencies are inferred from the claim text.