Printed substrate forming method
AssigneeFuji Corporation
InventorRyojiro Tominaga
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AssigneeFuji Corporation
InventorRyojiro Tominaga
Estimating the term…
A printed substrate forming method includes: a resin layer forming step of forming a resin layer with curable resin in a specific region that is a region other than a predetermined region of a base which is composed of an insulating layer and a conductor layer, the predetermined region of which being a region on which a solder resist is formed; and a wiring forming step of forming a wiring by discharging metal-containing liquid which contains metal fine particles onto a top surface of the resin layer, and firing the metal-containing liquid.
A printed substrate forming method comprising:
Dependencies are inferred from the claim text.
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Directly combined with via connections: via provided in pad; Pad over filled via
After-treatment of the printed patterns, e.g. sintering or curing methods: firing or sintering at relative high temperatures for patterns on…
Directly combined with via connections: pad being close to via, but not surrounding the via
By ink-jet printing or drawing by dispensing: by ink-jet printing
About 11 years 6 months of term left · ends 11 May 2038 (estimated)
The present application relates to a method of forming a printed substrate that includes a base composed of an insulating layer and a conductor layer, and a forming device.
As disclosed in the Patent Literature below, in a general printed substrate, a solder resist is formed on an upper surface of a base composed of an insulating layer and a conductor layer.
PTL 1: JP-A-2006-59942
FIG. 1 is a diagram illustrating a custom section forming device.
FIG. 2 is a block diagram illustrating a control device.
FIG. 3 is a diagram illustrating a general-purpose section forming device.
FIG. 1 and FIG. 2 illustrate circuit forming system 10. Circuit forming system 10 is configured with custom section forming device 12 illustrated in FIG. 1 and general-purpose section forming device 14 illustrated in FIG. 3
Custom section forming device 12 is a so-called 3D printer, and includes conveyance device 20, first shaping unit 22, second shaping unit 24, mounting unit 26, and control device (refer to FIG. 2) 27. Conveyance device 20, first shaping unit 22, second shaping unit 24, and mounting unit 26 are arranged on base 28 of custom section forming device 12. Base 28 has a substantially rectangular shape, and in the following description, the longitudinal direction of base 28 will be referred to as the X-axis direction, the lateral direction of base 28 will be referred to as the Y-axis direction, and the direction orthogonal to both the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction.
Conveyance device 20 includes X-axis slide mechanism 30 and Y-axis slide mechanism 32. X-axis slide mechanism 30 includes X-axis slide rail 34 and X-axis slider 36. X-axis slide rail 34 is disposed on base 28 so as to extend in the X-axis direction. X-axis slider 36 is held by X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, X-axis slide mechanism 30 includes electromagnetic motor (refer to FIG. 2) 38, and by driving electromagnetic motor 38, X-axis slider 36 moves to any position in the X-axis direction. Y-axis slide mechanism 32 includes Y-axis slide rail 50 and stage 52. Y-axis slide rail 50 is disposed on base 28 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of Y-axis slide rail 50 is coupled to X-axis slider 36. On Y-axis slide rail 50, stage 52 is held so as to be slidable in the Y-axis direction. Furthermore, Y-axis slide mechanism 32 includes electromagnetic motor (refer to FIG. 2) 56, and by driving electromagnetic motor 56, stage 52 moves to any position in the Y-axis direction. As a result, by driving X-axis slide mechanism 30 and Y-axis slide mechanism 32, stage 52 is moved to any position on base 28