Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device

A multilayer substrate mounting structure comprising:

• a multilayer substrate;
• and
• a mounting substrate on which the multilayer substrate is mounted, the mounting substrate including a mounting surface and a bonding electrode on the mounting surface;
• wherein
• the multilayer substrate includes:
• a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;
• and
• a conductor pattern including:
• an inner layer pattern provided inside the stacked body;
• a mounting electrode provided on the main surface and electrically connected to the inner layer pattern;
• and
• a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• the first auxiliary pattern is not electrically connected to the bonding electrode, and the first auxiliary pattern is electrically independent from the mounting electrode and the inner layer pattern;
• the mounting electrode is electrically connected to the bonding electrode and physically bonds the multilayer substrate to the mounting substrate;
• and
• a distance between the mounting electrode and the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is smaller than a width of the first auxiliary pattern in the first direction.

A method of manufacturing a multilayer substrate including a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;

• and a conductor pattern including:
• an inner layer pattern provided inside the stacked body, a mounting electrode provided on the main surface and electrically connected to the inner layer pattern, and a first auxiliary pattern provided on the main surface, the method comprising:
• a conductor pattern forming step of forming the mounting electrode, and the first auxiliary pattern located adjacent to or in a vicinity of the mounting electrode, on a surface of an insulating base material layer defining and functioning as the main surface, among the plurality of insulating base material layers;
• and
• a stacked body forming step of forming the stacked body by stacking the plurality of insulating base material layers and heating and pressing the stacked insulating base material layers, after the conductor pattern forming step, wherein
• the mounting electrode is electrically connected to a structure outside of the multilayer substrate and physically bonds the multilayer substrate to the structure;
• the mounting electrode is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• the first auxiliary pattern is electrically independent from the mounting electrode and the inner layer pattern;
• and
• a distance between the mounting electrode and the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is smaller than a width of the first auxiliary pattern in the first direction.

A method of manufacturing an electronic device including a multilayer substrate, and a mounting substrate including a mounting surface, and a bonding electrode on the mounting surface, wherein the multilayer substrate includes a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;

• and a conductor pattern including an inner layer pattern provided inside the stacked body, a mounting electrode provided on the main surface and electrically connected to the inner layer pattern, and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• the first auxiliary pattern is electrically independent from the mounting electrode and the inner layer pattern;
• and a distance between the mounting electrode and the first auxiliary pattern in a first direction that crosses the mounting electrode and the first auxiliary pattern is smaller than a width of the first auxiliary pattern in the first direction, the method comprising:
• an anisotropic element placing step of placing an insulating anisotropic conductive film on a surface of the bonding electrode being a convex portion protruding farther than at least other portions of the mounting surface;
• a multilayer substrate placing step of stacking the multilayer substrate on the mounting surface of the mounting substrate so that the mounting electrode may face the bonding electrode while interposing the insulating anisotropic conductive film between the multilayer substrate and the mounting substrate, after the anisotropic element placing step;
• and
• a heating and pressing step of heating and pressing the multilayer substrate and the mounting substrate in a direction in which the multilayer substrate and the mounting substrate are stacked on each other, electrically connecting the mounting electrode and the bonding electrode, and physically bonding the multilayer substrate to the mounting substrate by the mounting electrode, after the multilayer substrate placing step.

A multilayer substrate comprising:

• a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;
• and
• a conductor pattern including:
• an inner layer pattern provided inside the stacked body;
• a mounting electrode provided on the main surface and electrically connected to the inner layer pattern;
• a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• and
• a second auxiliary pattern provided inside the stacked body and surrounding the inner layer pattern in the plan view of the main surface;
• wherein
• the mounting electrode is electrically connected to a structure outside of the multilayer substrate and physically bonds the multilayer substrate to the structure;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• the first auxiliary pattern is electrically independent from the mounting electrode and the inner layer pattern;
• and
• the inner layer pattern includes a rectangular loop-shaped conductor pattern or a substantially rectangular loop-shaped conductor pattern.

A multilayer substrate comprising:

• a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;
• and
• a conductor pattern including:
• an inner layer pattern inside the stacked body;
• a mounting electrode provided on the main surface and electrically connected to the inner layer pattern;
• and
• a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• wherein
• the mounting electrode is electrically connected to a structure outside of the multilayer substrate and physically bonds the multilayer substrate to the structure;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• the first auxiliary pattern is electrically independent from the mounting electrode and the inner layer pattern;
• no protective layer is provided on the stacked body;
• and
• a portion of the main surface on which the mounting electrode is provided is a convex portion protruding farther than other portions.

A multilayer substrate comprising:

• a stacked body including a plurality of insulating base material layers made of a thermoplastic resin as a main material and stacked on one another, and including a main surface;
• and
• a conductor pattern including:
• an inner layer pattern provided inside the stacked body;
• a mounting electrode provided on the main surface and electrically connected to the inner layer pattern;
• and
• a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• wherein
• the mounting electrode is electrically connected to a structure outside of the multilayer substrate and physically bonds the multilayer substrate to the structure;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• and
• the first auxiliary pattern is electrically independent from the mounting electrode and the inner layer pattern.