Surface-treated copper foil and copper clad laminate
AssigneeChang Chun Petrochemical Co., Ltd.
InventorsChien-Ming Lai, Yao-Sheng Lai, Jui-Chang Chou
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Abstract
A surface-treated copper foil including a treating surface, where the root mean square height (Sq) of the treating surface is in a range of 0.20 to 1.50 μm and the texture aspect ratio (Str) of the treating surface is not greater than 0.65. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of (111) peak to the sum of the integrated intensities of (111) peak, (200) peak, and (220) peak of the treating surface is at least 60%.
Claims11
A surface-treated copper foil, comprising a treating surface, wherein a root mean square height (Sq) of the treating surface is in a range of 0.20 to 1.50 μm and a texture aspect ratio (Str) of the treating surface is not greater than 0.65, and when the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of a copper (111) peak to the sum of the integrated intensities of the copper (111) peak, a copper (200) peak, and a copper (220) peak of the treating surface is at least 60%.
A copper-clad laminate, comprising:
- a board;
- and
- a surface-treated copper foil, disposed on at least one surface of the board, wherein the surface-treated copper foil comprises:
- a bulk copper foil;
- and
- a surface treatment layer, disposed between the bulk copper foil and the board, wherein the surface treatment layer comprises a treating surface facing toward the board, and a root mean square height (Sq) of the treating surface is in a range of 0.20 to 1.50 μm and a texture aspect ratio (Str) of the treating surface is not greater than 0.65, wherein the ratio of the integrated intensity of a copper (111) peak to the sum of the integrated intensities of the copper (111) peak, a copper (200) peak, and a copper (220) peak of the treating surface is at least 60%.
Dependencies are inferred from the claim text.