Compact ultrasound imaging apparatus

A method, comprising:

• obtaining a first printed circuit board (PCB) with a top surface and a bottom surface;
• affixing a first transmitter (Tx) comprising a number N of channels to the bottom surface;
• affixing a second Tx comprising the number N of channels to the top surface, wherein the second Tx is aligned on the top surface over the first Tx on the bottom surface;
• shorting one or more pins of the first Tx with one or more pins of the second Tx having a same function;
• affixing an analog front end (AFE) device comprising a number N of input channels to the top surface;
• obtaining a second PCB;
• and
• affixing a power supply module to the second PCB.

A device with a first printed circuit board (PCB) and a second PCB, comprising:

• a first transmitter (Tx) device comprising a number N of channels and arranged on a bottom surface of the first PCB,
• a second Tx device comprising the number N of channels and arranged on a top surface of the first PCB over the first Tx device, wherein:
• each channel of the 2N channels of the first and second Tx devices comprises a respective receiver, transmitter, transmit/receive (T/R) switch, and output pin,
• each output pin of the first Tx device is shorted with a corresponding output pin of the second Tx device,
• each particular T/R switch is configured to disconnect the particular receiver from the particular transmitter while the corresponding channel is selected;
• an analog front end (AFE) device comprising N input channels and arranged on the top surface of the first PCB, wherein the N input channels are coupled to the N shorted output pins of the first and second Tx devices;
• a digital signal processor (DSP) coupled to the AFE device and arranged on the top surface of the first PCB;
• a peripheral controller arranged on the second PCB and coupled to the DSP;
• an output interface arranged on the second PCB and coupled to the peripheral controller;
• and
• a power supply module configured to provide a plurality of supply voltages to the first and second PCBs.