Signal transmission circuit and printed circuit board

A printed circuit board, comprising:

• a surface layer including a plurality of signal transmission paths that transmit a signal, each having a pair of signal lines extending in a first direction in plan view, and a pair of signal line through holes that respectively connect respective ends of the pairs of signal lines of the signal transmission paths with a signal layer of an inner layer, the printed circuit board further including a first ground through hole having a center aligned with respective centers of the pairs of signal line through holes in a second direction that is orthogonal to the first direction and is connected with a ground layer that forms a return current circuit for the signal transmission paths,
• wherein a ground pattern having a rectangular shape includes a first ground area and a second ground area respectively disposed on both sides of a first signal transmission path, of the plurality of the signal transmission paths, in the second direction and a first side ground area is connected with at least respective one end sides of the first ground area and the second ground area,
• wherein the signal transmission paths and the respective pairs of signal lines are disposed in a cutout of the ground pattern and are in the same layer as the ground pattern, and are surrounded on all sides by the ground pattern,
• wherein the first ground through hole is disposed to connect the ground pattern with the ground layer, and
• wherein the first side ground area extends to a side of the rectangular ground pattern in the first direction and extends to the respective one end sides of the first ground area and the second ground area in the first direction.

A signal transmission circuit, comprising:

• a printed circuit board including a surface layer including a plurality of signal transmission paths, including a first signal transmission path and a second signal transmission path that transmit a signal, each of the plurality of signal transmission paths has a pair of signal lines extending in a first direction in plan view, a plurality of signal line through holes that respectively connect the signal transmission paths with a signal layer disposed in an inner layer of the printed circuit board, the printed circuit board including a first ground through hole having a center aligned with respective centers of the pair of signal line through holes in a second direction that is orthogonal to the first direction and is connected with a ground layer of the inner layer of the printed circuit board that forms a return current transmission path for the signal transmission paths,
• wherein a ground pattern having a rectangular shape includes a plurality of ground areas including a first ground area, a second ground area and a third ground area, the first ground area and the second ground area respectively disposed on both sides of the first signal transmission path in the second direction, the second ground area and the third ground area respectively disposed on both sides of the second signal transmission path in the second direction,
• wherein the signal transmission paths and the respective pairs of signal lines are disposed in respective cutouts of the ground pattern and are in the same layer as the ground pattern, and are surrounded on all sides by the ground pattern,
• wherein the ground pattern includes a first side ground area connected with at least respective one end sides of the first ground area, the second ground area and the third ground area,
• wherein the ground through hole is disposed to connect the ground pattern with the ground layer, and
• wherein the first side ground area extends to a side of the rectangular ground pattern in the first direction and extends to the respective one end sides of the first ground area, the second ground area and the third ground are in the first direction.