Method of manufacturing a power semiconductor system
AssigneeInfineon Technologies Austria AG
InventorsPetteri Palm, Frank Daeche, Zeeshan Umar, Andrew Sawle, Maciej Wojnowski, Xaver Schloegel, Josef Hoeglauer
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Abstract
A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.
Claims6
A method of manufacturing a power semiconductor system, the method comprising:
- providing a power module comprising one or more power transistor dies;
- and
- attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module, the inductor module comprising a substrate,
- wherein the substrate comprises an insulating material in which a magnetic material is embedded, and first and second metal sheets laminated onto the insulating material over opposite sides of the magnetic material,
- wherein windings are formed by metal traces patterned into the first and second metal sheets.
A method of manufacturing a power semiconductor system, the method comprising:
- providing a power module comprising one or more power transistor dies;
- and
- attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module, the inductor module comprising a substrate,
- wherein the substrate comprises an insulating material in which a magnetic material is embedded, and first and second metal sheets laminated onto the insulating material over opposite sides of the magnetic material,
- wherein windings are formed by metal traces patterned into the first and second metal sheets,
- wherein the magnetic material has a plurality of elongated openings,
- wherein a first group of electrically conductive vias passes through a first one of the elongated openings and a second group of electrically conductive vias passes through a second one of the elongated openings to connect the metal traces and form one or more coils.
A method of manufacturing a power semiconductor system, the method comprising:
- providing a power module comprising one or more power transistor dies;
- and
- attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module, the inductor module comprising a substrate,
- wherein the substrate comprises an insulating material in which a magnetic material is embedded, and first and second metal sheets laminated onto the insulating material over opposite sides of the magnetic material,
- wherein windings are formed by metal traces patterned into the first and second metal sheets,
- wherein the magnetic material is patterned into an elongated toroid,
- wherein a first group of electrically conductive vias extends along a first outer elongated side of the toroid, a second group of electrically conductive vias extends along a first inner elongated side of the toroid, a third group of electrically conductive vias extends along a second inner elongated side of the toroid and a fourth group of electrically conductive vias extends along a second outer elongated side of the toroid to connect the metal traces and form one or more coils.
Dependencies are inferred from the claim text.