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US 11,539,183 B2Granted
Passive thermal management for semiconductor laser based lidar transmitter
AssigneeBeijing Voyager Technology Co., Ltd.
InventorsYu-Ching Yeh, Yue Lu, Youmin Wang
Life of this patent
Estimating the term…
Abstract
A laser package is mounted on the printed circuit board. At least one thermal via extends through the printed circuit board, coupled to the laser package. A thermal bridge is coupled to the at least one thermal via on the bottom of the printed circuit board. A thermal paste connects the thermal bridge to a conductive ground plane on the bottom of the printed circuit board, and to a mechanical housing.
Claims20
An apparatus for laser thermal management in a Light Detection and Ranging (LiDAR) system of an autonomous vehicle, the apparatus comprising:
- a printed circuit board;
- a laser driver mounted on the printed circuit board;
- a trigger trace on a top of the printed circuit board, connected to an output of the laser driver;
- a plurality of laser diodes in parallel for emitting a plurality of laser beams with a wavelength;
- a laser package having a substrate coupled to an N-node of the plurality of laser diodes;
- a solder paste coupling the substrate of the laser package to the trigger trace;
- a plurality of thermal vias through the printed circuit board, connected to the trigger trace beneath the laser package;
- at least one conductive pad connected to the thermal vias on a bottom of the printed circuit board;
- at least one thermal bridge connected to the at least one conductive pad on a bottom of the printed circuit board;
- a thermal paste connected to the at least one thermal bridge;
- a conductive ground plane on the bottom of the printed circuit board, connected to the thermal paste;
- and
- a mechanical housing connected to the thermal paste;
- whereby a thermal heat dissipation path is created from the laser package through the solder paste, the plurality of thermal vias, the conductive pad, the thermal bridge, the thermal paste, the conductive ground plane and the mechanical housing.
11 more elements
An apparatus comprising:
- a printed circuit board;
- a laser package mounted on the printed circuit board;
- at least one thermal via through the printed circuit board, coupled to the laser package;
- a thermal bridge coupled to the at least one thermal via;
- a thermal paste connected to the thermal bridge;
- a conductive ground plane on a bottom of the printed circuit board, connected to the thermal paste;
- and
- a mechanical housing connected to the thermal paste;
- whereby a thermal heat dissipation path is created from the laser package through the thermal via, the thermal bridge, the thermal paste, the conductive ground plane and the mechanical housing.
6 more elements
A method comprising:
- providing a printed circuit board;
- forming a thermal via through the printed circuit board;
- forming a conductive ground plane on a bottom of the printed circuit board;
- mounting a laser package on the printed circuit board, coupled to the thermal via;
- coupling a thermal bridge to the thermal via;
- connecting a thermal paste to the thermal bridge and to the conductive ground plane;
- and
- connecting the thermal paste to a mechanical housing;
- whereby a thermal heat dissipation path is created from the laser package through the thermal via, the thermal bridge, the thermal paste, the conductive ground plane and the mechanical housing.
6 more elements
Dependencies are inferred from the claim text.