Circuit arrangement consisting of two interconnected high-frequency components

A circuit arrangement comprising a first high-frequency component and a second high-frequency component interconnected with each other,

• wherein a connection for transferring high-frequency signals between the first high-frequency component and the second high-frequency component is arranged between the first high-frequency component and the high-frequency second component;
• wherein the connection comprises at least one inner conductor;
• wherein the inner conductor is at least partially enclosed by an outer conductor;
• wherein the inner conductor is connected to the first high-frequency component and to the second high-frequency component, in order to transfer high-frequency signals;
• wherein the second high-frequency component comprises a contact surface on a connecting surface;
• wherein the inner conductor is pressed using a pressure force onto the contact surface to establish a high-frequency connection between the first high-frequency component and the second high-frequency component,
• wherein the outer conductor is configured as a grid structure or honeycomb structure and is arranged between the first high-frequency component and the second high-frequency component;
• wherein the outer conductor forms a plurality of chambers and each chamber is at least partially enclosed by a material of the outer conductor;
• and
• wherein an inner conductor of the at least one inner conductor is arranged in each chamber.