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US 11,539,150 B2Granted
Pin, pin combination structure, package body, and method for manufacturing package body
AssigneeHuawei Technologies Co., Ltd.
InventorsHong Wu, Zhen Lv
Life of this patent
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Abstract
Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.
Claims15
A pin for a package body, the pin comprising:
- a pin body, wherein a bottom of the pin body is soldered to a substrate of the package body;
- and
- a baffle structure, wherein the baffle structure is sleeved onto a middle of the pin body between a first part of the pin body and a second part of the pin body, the first part of the pin body comprising a top of the pin body and the second part of the pin body comprising the bottom of the pin body, and wherein the baffle structure is configured to prevent a plastic packaging material from contacting the first part of the pin body when the plastic packaging material is filled into a cavity in a mold to cover the substrate and at least a portion of the second part of the pin body.
A pin combination structure for a package body, comprising:
- at least two pins;
- and
- a baffle structure, wherein
- a bottom of each of the at least two pins is soldered to a substrate of the package body, and a plastic packaging material of the package body covers the substrate and wraps a bottom-to-middle part of each pin of the at least two pins;
- at least two slots are provided on the baffle structure, wherein each of the at least two slots of the baffle structure is sleeved on a middle of the each pin, and the at least two slots are in a one-to-one correspondence with the at least two pins;
- and
- wherein the baffle structure is configured to prevent the plastic packaging material from overflowing onto a middle-to-top part of each pin when the plastic packaging material is filled into a cavity in a mold for packaging the package body to accommodate bottom-to-middle parts of the at least two pins and the substrate, wherein the substrate is located at a bottom of the cavity, wherein middles of the at least two pins are located at a top of the cavity, a side wall at the top of the cavity abuts against the baffle structure, and a bottom-to-top height of the cavity is lower than a bottom-to-top height of the at least two pins.
4 more elements
A package body, comprising:
- a substrate;
- a plastic packaging material;
- a pin;
- and
- a baffle structure sleeved on the pin;
- wherein a bottom of a body of the pin is soldered to the substrate, the baffle structure is sleeved on a middle of the pin, and the plastic packaging material covers the substrate and wraps a bottom-to-middle part of the pin;
- and wherein the baffle structure is configured to prevent the plastic packaging material from overflowing onto a middle-to-top part of the pin when the plastic packaging material is filled into a cavity in a mold for packaging the package body to accommodate the bottom-to-middle part of the pin and the substrate, wherein the substrate is located at a bottom of the cavity, the middle of the body is located at a top of the cavity, a side wall at the top of the cavity abuts against the baffle structure, and a bottom-to-top height of the cavity is lower than a bottom-to-top height of the pin.
4 more elements
Dependencies are inferred from the claim text.