Substrate integrated waveguide transition including a metallic layer portion having an open portion that is aligned offset from a centerline

A method comprising:

• conducting electromagnetic energy via a transmission line on a printed circuit board (PCB);
• coupling the electromagnetic energy into a waveguide via an SIW transition, wherein the SIW transition comprises:
• a dielectric substrate having a top surface and a bottom surface;
• a first metallic layer portion coupled to the top surface of the dielectric substrate, wherein the first metallic layer portion comprises:
• (i) a single-ended termination, (ii) an impedance transformer, and (iii) a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch, wherein a centerline extends through a center of the single-ended termination and a center of the impedance transformer, and wherein the open portion is aligned offset relative to the centerline;
• a second metallic layer portion coupled to the bottom surface of the dielectric substrate;
• and
• a set of metallic via-holes electrically coupling the first metallic layer portion to the second metallic layer portion;
• and
• transmitting the electromagnetic energy as signals via one or more antennas coupled to the waveguide.

A system comprising:

• a waveguide;
• a substrate integrated waveguide (SIW) transition coupled to the waveguide, wherein the SIW transition comprises:
• a dielectric substrate having a top surface and a bottom surface;
• a first metallic layer portion coupled to the top surface of the dielectric substrate, wherein the first metallic layer portion comprises:
• a single-ended termination,
• an impedance transformer, and
• a metallic rectangular patch located within an open portion in the first metallic layer portion such that the open portion forms a non-conductive loop around the metallic rectangular patch, wherein a centerline extends through a center of the single-ended termination and a center of the impedance transformer, and
• wherein the open portion is aligned offset relative to the centerline;
• a second metallic layer portion coupled to the bottom surface of the dielectric substrate;
• and
• a set of metallic via-holes electrically coupling the first metallic layer portion to the second metallic layer portion.