Miniaturized electronics package with patterned thin film solid state battery
AssigneeInternational Business Machines Corporation
InventorsQianwen Chen, Bing Dang, John U. Knickerbocker
Life of this patent
Estimating the term…
Abstract
A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.
Claims20
A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
- a thin film microbattery;
- an interposer electrically connected to the thin film microbattery;
- electronic circuitry disposed on the interposer;
- and
- a seal formed over the thin film microbattery and the electronic circuitry to create individual microbattery modules;
- wherein the thin film microbattery is disposed directly between the electronic circuitry and wherein all of the electronic circuitry directly contacts and extends above a topmost surface of the interposer.
A structure for integrating a thin film microbattery with electronic circuitry, the structure comprising:
- a thin film microbattery electrically connected to an interposer;
- and
- electronic circuitry disposed on the interposer after complete formation of the thin-film microbattery;
- wherein the thin film microbattery is disposed directly between the electronic circuitry and wherein all of the electronic circuitry directly contacts and extends above a topmost surface of the interposer.
Dependencies are inferred from the claim text.