Light emitting diode display panel with one or more encapsulation layers and manufacturing method thereof

A method for manufacturing a light emitting diode display panel, comprising:

• providing a substrate;
• forming a pixel defining layer on the substrate, the pixel defining layer defining a pixel opening;
• forming a light emitting diode on the substrate, the light emitting diode being formed within the pixel opening;
• forming a first encapsulation layer on a light emitting side of the light emitting diode such that a portion of the first encapsulation layer within the pixel opening comprises a sidewall inclined with respect to the substrate, a surface of the sidewall facing the light emitting diode comprises a plurality of first portions and a plurality of second portions alternately arranged in a direction away from the light emitting diode and connected to each other, inclination angles of the plurality of first portions with respect to the substrate are smaller than inclination angles of the plurality of second portions with respect to the substrate,
• wherein a refractive index of a material of the first encapsulation layer is greater than a refractive index of a material of an immediately physically adjoining layer on top of the first encapsulation layer and a refractive index of a material of an immediately physically adjoining layer on bottom of the first encapsulation layer,
• forming the pixel defining layer comprises:
• forming a plurality of pixel defining sub-layers which are stacked in a direction away from the substrate, the pixel opening comprises a plurality of pixel sub-openings respectively penetrating through the plurality of pixel defining sub-layers, and opening areas of the plurality of pixel sub-openings increase in the direction away from the substrate, and
• a material of each pixel defining sub-layer comprises a negative photoresist containing a photosensitizer, and a pixel defining sub-layer farther away from the substrate has a higher photosensitizer content.