Imaging unit, method for manufacturing the same, and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorsKenya Nishio, Suguru Saito
Life of this patent
Estimating the term…
Abstract
Provided is an imaging unit more efficiently manufacturable with high dimensional precision. The imaging unit includes: a sensor board including an imaging device, in which the imaging device has a plurality of pixels and allows generation of a pixel signal by receiving outside light in each of the plurality of pixels; a bonding layer including an inorganic insulating material; and a circuit board including a circuit chip and an organic insulating layer, in which a circuit chip has a signal processing circuit that performs signal processing for the pixel signal and is bonded to the sensor board through the bonding layer, and the organic insulating layer covers a vicinity of the circuit chip.
Claims16
An imaging unit comprising:
- a sensor board including an imaging device, the imaging device having a plurality of pixels and allowing generation of a pixel signal by receiving outside light in each of the plurality of pixels;
- a bonding layer including an inorganic insulating material;
- and
- a circuit board including a circuit chip and an organic insulating layer, the circuit chip having a signal processing circuit that performs signal processing for the pixel signal and being bonded to the sensor board through the bonding layer, the organic insulating layer covering a vicinity of the circuit chip.
A method for manufacturing an imaging unit, the method comprising:
- disposing, above a support substrate, a circuit chip having a signal processing circuit, the signal processing circuit performing signal processing for a pixel signal;
- forming an organic insulating layer above the support substrate to allow the organic insulating layer to cover a vicinity of the circuit chip;
- forming a bonding layer using an inorganic insulating material to allow the bonding layer to cover the circuit chip and the organic insulating layer;
- and
- bonding a sensor board to the circuit chip through the bonding layer, the sensor board including an imaging device, the imaging device having a plurality of pixels and allowing generation of a pixel signal by receiving outside light in each of the plurality of pixels.
An electronic apparatus including an imaging unit, the imaging unit comprising:
- a sensor board including an imaging device, the imaging device having a plurality of pixels and allowing generation of a pixel signal by receiving outside light in each of the plurality of pixels;
- a bonding layer including an inorganic insulating material;
- and
- a circuit board including a circuit chip and an organic insulating layer, the circuit chip having a signal processing circuit that performs signal processing for the pixel signal and being bonded to the sensor board through the bonding layer, the organic insulating layer covering a vicinity of the circuit chip.
Dependencies are inferred from the claim text.