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US 11,538,817 B2Granted
Bonded memory devices and methods of making the same
AssigneeSanDisk Technologies LLC
InventorsRaghuveer S. Makala, Johann Alsmeier
Life of this patent
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Abstract
At least a portion of a memory cell is formed over a first substrate and at least a portion of a steering element or word or bit line of the memory cell is formed over a second substrate. The at least a portion of the memory cell is bonded to at least a portion of a steering element or word or bit line. At least one of the first or second substrate may be removed after the bonding.
Claims11
A method of forming a memory device, comprising:
- providing a first assembly comprising at least a portion of a memory cell located over a first substrate;
- providing a second assembly comprising at least a portion of a selector element located over a second substrate;
- and
- bonding the first assembly to the second assembly such that the memory cell is bonded to its respective selector element.
1 more element
Dependencies are inferred from the claim text.