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US 11,538,798 B2Granted
Semiconductor package with multiple redistribution substrates
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeonjeong Hwang, Kyoung Lim Suk, Seokhyun Lee, Jaegwon Jang
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Abstract
A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a first molding layer on the first redistribution substrate and covering a top surface and lateral surfaces of the first semiconductor chip, a second redistribution substrate on the first molding layer, and an adhesive film between the second redistribution substrate and the first molding layer. The adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer. A lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate.
Claims18
A semiconductor package, comprising:
- a first redistribution substrate;
- a first semiconductor chip mounted on the first redistribution substrate;
- a first molding layer on the first redistribution substrate, the first molding layer covering a top surface and lateral surfaces of the first semiconductor chip, the top surface facing away from the first redistribution substrate;
- a second redistribution substrate on the first molding layer, the second redistribution substrate comprising a connection pad and a connection terminal on a bottom surface of the connection pad;
- a conductive structure that connects the first redistribution substrate to the second redistribution substrate;
- and
- an adhesive film between the second redistribution substrate and the first molding layer,
- wherein the adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer,
- wherein a lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate,
- wherein the connection terminal comprises a first part and a second part that surrounds a lower portion of the first part,
- wherein the second part is between the first part and the conductive structure and covers a top surface of the conductive structure,
- wherein a maximum width of the first part of the connection terminal is less than a width of the conductive structure, and
- wherein a maximum width of the second part of the connection terminal is equal to a width of the conductive structure.
10 more elements
A semiconductor package, comprising:
- a first redistribution substrate;
- a first semiconductor chip mounted on the first redistribution substrate;
- a first molding layer on the first redistribution substrate, the first molding layer covering a top surface and lateral surfaces of the first semiconductor chip, the top surface facing away from the first redistribution substrate;
- a second redistribution substrate on the first molding layer;
- a conductive structure that connects the first redistribution substrate to the second redistribution substrate,
- a second semiconductor chip mounted on the second redistribution substrate;
- and
- an adhesive film between the second redistribution substrate and the first molding layer,
- wherein the second redistribution substrate comprises:
- an upper dielectric layer;
- a connection pad exposed by the upper dielectric layer;
- and
- a connection terminal on a bottom surface of the connection pad,
- wherein the adhesive film extends in a first direction parallel to the top surface of the first semiconductor chip, the adhesive film being in contact with a top surface of the first molding layer and with a bottom surface of the upper dielectric layer of the second redistribution substrate, and
- wherein a width in the first direction of the adhesive film is equal to a width in the first direction of the first redistribution substrate
- wherein the connection terminal comprises a first part and a second part that surrounds a lower portion of the first part,
- wherein the second part is between the first part and the conductive structure and covers a top surface of the conductive structure,
- wherein a maximum width of the first part of the connection terminal is less than a width of the conductive structure, and
- wherein a maximum width of the second part of the connection terminal is equal to a width of the conductive structure.
16 more elements
A semiconductor package, comprising:
- a first redistribution substrate;
- a first semiconductor chip mounted on the first redistribution substrate;
- a first molding layer on the first redistribution substrate, the first molding layer covering a top surface and lateral surfaces of the first semiconductor chip, the top surface of the first semiconductor chip facing away from the first redistribution substrate;
- a second redistribution substrate on the first molding layer;
- a second semiconductor chip mounted on the second redistribution substrate;
- a second molding layer on the second redistribution substrate, the second molding layer covering a top surface and lateral surfaces of the second semiconductor chip;
- an adhesive film between the second redistribution substrate and the first molding layer;
- a conductive structure that penetrates the first molding layer and connects the first redistribution substrate to the second redistribution substrate;
- and
- an external terminal on a bottom surface of the first redistribution substrate,
- wherein the first redistribution substrate comprises:
- an under-bump pattern in contact with the external terminal;
- a first connection pad in contact with the conductive structure;
- a plurality of first redistribution patterns that connect the first connection pad to the under-bump pattern;
- and
- a lower dielectric layer that surrounds the plurality of first redistribution patterns,
- wherein a lateral surface of the adhesive film is coplanar with a lateral surface of the first molding layer,
- wherein the second redistribution substrate comprises a connection terminal in contact with the conductive structure and the adhesive film,
- wherein the connection terminal comprises a first part and a second part that surrounds a lower portion of the first part,
- wherein the second part is between the first part and the conductive structure and covers a top surface of the conductive structure,
- wherein a maximum width of the first part of the connection terminal is less than a width of the conductive structure, and
- wherein a maximum width of the second part of the connection terminal is equal to a width of the conductive structure.
19 more elements
Dependencies are inferred from the claim text.