Extended HBM offsets in 2.5D interposers
AssigneeBroadcom International Pte. Ltd.
InventorsMohamed Anwar Ali, Thinh Quang Tran, Tauman T. Lau
Life of this patent
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Abstract
A semiconductor package includes an interposer, a number of a first integrated circuit (IC) dies, one or more second IC dies, and one or more dummy dies. The first IC dies, the second IC dies and the dummy dies are implemented on the interposer. The dummy dies are configured to enable routing of pins of the first IC dies to selected circuits of the second IC dies while conforming to predefined routing rules.
Claims20
A semiconductor package comprising:
- an interposer;
- a plurality of a first integrated circuit (IC) dies;
- one or more second IC dies;
- and
- one or more dummy dies,
- wherein the plurality of the first IC dies, the one or more second IC dies and the one or more dummy dies are implemented on the interposer, and wherein the one or more dummy dies are configured to enable routing of pins of the plurality of first IC dies to selected circuits of the one or more second IC dies while conforming to predefined routing rules.
A method of packaging semiconductor dies, the method comprising:
- placing a plurality of a first integrated circuit (IC) dies on an interposer;
- placing one or more second IC dies on the interposer;
- and
- placing one or more dummy dies on the interposer,
- wherein placing the one or more dummy dies comprises configuring the one or more dummy dies to enable routing of pins of the plurality of first IC die to selected circuits of the one or more second IC dies while conforming to predefined routing rules.
An interposer with extended high-bandwidth memory (HBM) offsets, the interposer comprising:
- a plurality of HBM dies;
- two or more application-specific integrated circuits (ASICs);
- and
- one or more dummy dies placed on the interposer,
- wherein sizes and placement locations of one or more dummy dies are configured to enable routing of pins of the plurality of HBM dies to selected circuits of the one or more ASIC dies while conforming to predefined routing rules;
- and wherein the one or more dummy dies are placed at the configured placement locations on the interposer.
Dependencies are inferred from the claim text.