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US 11,538,787 B2Granted
Method and system for manufacturing a semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChe-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee, Chih-Hsiang Hsu
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Abstract
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).
Claims15
A method for manufacturing a semiconductor package structure, comprising:
- (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant;
- (b) providing a flattening force to the package body;
- (c) thinning the package body after (b);
- (d) attaching a combination of a dicing tape and a back side film to the package body;
- (e) releasing the flattening force after (d);
- (f) curing the back side film;
- and
- (g) forming a mark on the back side film by a light irradiation passing through the dicing tape.
5 more elements
Dependencies are inferred from the claim text.