A method of manufacturing an optoelectronic semiconductor device, comprising steps of:
- a preparation step:
- preparing at least one optoelectronic semiconductor stamp group and a target substrate, wherein each of the at least one optoelectronic semiconductor stamp group comprises at least one optoelectronic semiconductor stamp, a manufacturing method of each of the at least one optoelectronic semiconductor stamp comprises steps of:
- providing an optoelectronic semiconductor substrate, wherein the optoelectronic semiconductor substrate comprises a plurality of optoelectronic semiconductor components separately disposed on an epitaxial substrate, and each of the optoelectronic semiconductor components comprises at least one electrode;
- pressing the optoelectronic semiconductor substrate to an UV tape, wherein the electrodes of the optoelectronic semiconductor components are adhered to the UV tape;
- removing the epitaxial substrate, wherein a part of the optoelectronic semiconductor components are adhered to the UV tape;
- decreasing adhesion of the UV tape;
- and picking up the part of the optoelectronic semiconductor components adhered to the UV tape by a heat conductive substrate so as to obtain the optoelectronic semiconductor stamp, wherein the target substrate has a plurality of conductive portions;
- an align-press step:
- aligning and attaching the at least one optoelectronic semiconductor stamp to the target substrate, so that the electrodes are pressed on the corresponding conductive portions;
- a bonding step:
- electrically connecting the electrodes to the corresponding conductive portions;
- and
- a repeat step:
- repeating the align-press step and the bonding step,
- wherein the at least one optoelectronic semiconductor stamp group comprises a first optoelectronic semiconductor stamp group, the first optoelectronic semiconductor stamp group comprises a first optoelectronic semiconductor stamp and a second optoelectronic semiconductor stamp, the optoelectronic semiconductor components of the first optoelectronic semiconductor stamp and the second optoelectronic semiconductor stamp emit the same color lights, and
- wherein in the repeating step, a covering range of the second optoelectronic semiconductor stamp aligned and pressed on the target substrate excludes a covering range of the first optoelectronic semiconductor stamp aligned and pressed on the target substrate.