Semiconductor package including alignment material and method for manufacturing semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorHsu-Nan Fang
Life of this patent
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Abstract
A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first semiconductor device, a second semiconductor device, and an alignment material. The first semiconductor device has a first bonding layer, and the first bonding layer includes a first bond pad contacting an organic dielectric material. The second semiconductor device has a second bonding layer, and the second bonding layer includes a second bond pad contacting the organic dielectric material. The alignment material is between the first bonding layer and the second bonding layer.
Claims16
A semiconductor package, comprising:
- a first semiconductor device having a first bonding layer, wherein the first bonding layer comprises a first bond pad contacting an organic dielectric material;
- a second semiconductor device having a second bonding layer, wherein the second bonding layer comprises a second bond pad contacting the organic dielectric material;
- and
- an alignment material between the first bonding layer and the second bonding layer.
A semiconductor package, comprising:
- a first semiconductor device having a first bonding layer, the first bonding layer comprising a first bond pad contacting a dielectric material;
- a second semiconductor device having a second bonding layer, the second bonding layer comprising a second bond pad contacting the dielectric material, the first semiconductor device being bonded to the second semiconductor device through the first bond pad, the second bond pad, and the dielectric material;
- and
- a first area defined by the first bond pad and the second bond pad,
- wherein the first area comprises a recess of the first bond pad, the second bond pad, or the combination thereof, and the dielectric material conforms to a morphology of the first area.
A method for manufacturing a semiconductor package, comprising:
- providing a first semiconductor device having a first bonding layer, the first bonding layer comprising a first bond pad contacting a dielectric material and protruding from a top surface of the dielectric material;
- providing a second semiconductor device having a second bonding layer, the second bonding layer comprising a second bond pad;
- aligning the first bond pad and the second bond pad, comprising self-aligning the first bond pad and the second bond pad through soldering between the first bonding layer and the second bonding layer;
- and
- face-to-face bonding the first bond pad to the second bond pad by performing a thermal compression operation, wherein aligning the first bond pad and the second bond pad is prior to bonding the first bond pad to the second bond pad,
- wherein a plurality of solder bumps are formed on the first semiconductor device prior to the self-aligning.
Dependencies are inferred from the claim text.