Semiconductor structure containing pre-polymerized protective layer and method of making thereof

A method of forming a semiconductor structure, comprising:

• providing a semiconductor wafer including a plurality of semiconductor dies and bonding pads located within the plurality of semiconductor dies;
• providing a transfer substrate;
• forming a polymerized material layer on the transfer substrate;
• applying and patterning an etch mask layer over the polymerized material layer located on the transfer substrate, wherein openings are formed through the etch mask layer;
• etching portions of the polymerized material layer that are proximal to the openings through the etch mask layer by applying an etchant into the openings through the etch mask layer in an etch process to form discrete openings in the polymerized material layer located on the transfer substrate;
• removing the etch mask layer selective to the polymerized material layer;
• and
• attaching the polymerized material layer to the semiconductor wafer, wherein:
• the polymerized material layer is polymerized on the transfer substrate prior to the step of attaching the polymerized material layer to the semiconductor wafer;
• and
• top surfaces of the bonding pads are physically exposed in the discrete openings in the polymerized material layer after attaching the polymerized material layer to the semiconductor wafer.