Wireless transmission module and manufacturing method

A manufacturing method for a wireless transmission module, comprising:

• forming, on a carrier board, first cavities to accommodate a plurality of chips, a second cavity used to accommodate a passive component, and a plurality of first through holes;
• placing the chips and the passive component inside the first cavities and the second cavity;
• integrating the chips, the passive component, and the carrier board through a molding process;
• forming a plurality of blind holes on a lower surface of the carrier board opposite to the chips;
• filling the first through holes and the blind holes with a conductive material;
• manufacturing a first line layer and a second line layer on an upper surface and the lower surface of the carrier board, to form a substrate;
• forming a magnetic shield layer structure on the substrate;
• forming, on the magnetic shield layer structure, a plurality of second through holes extending through an upper surface and a lower surface of the magnetic shield layer structure;
• and
• filling the second through holes with the conductive material;
• and
• forming a coil on the magnetic shield layer structure, wherein the coil is interconnected with the chips through the second through holes, the first line layer, the first through holes, the blind holes, and the second line layer.

An electronic device, comprising:

• a mainboard;
• a rear cover;
• and
• a wireless transmission module disposed on the rear cover, wherein the wireless transmission module is conducted by using a flexible circuit board and is connected to the mainboard by using a connector, wherein the wireless transmission module comprises a substrate, a magnetic shield layer structure located on the substrate, and a coil located on the magnetic shield layer structure, wherein a plurality of chips and a passive component separated from each other are embedded inside the substrate;
• wherein the coil is electrically connected to the chips;
• a first line layer disposed on an upper surface of the substrate;
• a second line layer disposed on a lower surface of the substrate;
• a plurality of first through holes extending through the upper surface and the lower surface of the substrate, wherein the first through holes are filled with a conductive material;
• a plurality of second through holes extending through an upper surface and a lower surface of the magnetic shield layer structure, wherein the second through holes are filled with the conductive material;
• and
• a plurality of blind holes disposed between the second line layer and the chips, wherein the blind holes are filled with the conductive material,
• wherein the coil is interconnected with the chips through the second through holes, the first line layer, the first through holes, the blind holes, and the second line layer.