Electronic device package and method of manufacturing electronic device package

A method of manufacturing an electronic device package, comprising:

• preparing a strip board including a first surface and a second surface facing away from each other, wherein the strip board includes a first layer adjacent to the first surface and a second layer adjacent to the second surface, and wherein an antenna layer is formed on or in the second layer;
• forming a plurality of package units by mounting an electronic device on the first surface of the strip board and forming a molded portion covering the electronic device;
• forming a first cutting groove having a first width by partially sawing the strip board through the first layer for each package unit among the plurality of package units;
• forming a second cutting groove having a second width narrower than the first width by partially sawing the strip board through the second layer for each package unit;
• separating the strip board into a board for each package unit to form a step portion on a side surface between the first layer and the second layer;
• and
• forming a conductive film on the board for each package unit such that the conductive film extends from the molded portion to the step portion on the side surface between the first layer and the second layer.

An electronic device package, comprising:

• a board comprising a first layer and a second layer disposed below the first layer;
• an electronic device mounted on an upper surface of the first layer;
• an antenna layer formed in or on the second layer;
• a molded portion formed to cover the electronic device on the upper surface of the first layer;
• and
• a conductive film formed to cover a surface of the molded portion and a side surface of the first layer,
• wherein the side surface of the second layer extends farther than a corresponding side surface of the first layer, in a direction parallel to the upper surface of the first layer, and
• wherein the conductive film is not disposed on the corresponding side surface of the second layer.