Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsCheng-Yu Ho, Meng-Wei Hsieh
Life of this patent
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Abstract
The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.
Claims16
An antenna module, comprising:
- a first layer having a first dielectric constant (Dk);
- a second layer adjacent to the first layer, the second layer having a second Dk lower than the first Dk;
- a first antenna disposed on the first layer, the first antenna configured for operating at a first frequency;
- a second antenna disposed on the second layer, the second antenna configured for operating at a second frequency higher than the first frequency;
- and
- a plurality of feeding elements penetrating the second layer and electrically connected to the second antenna, wherein the feeding elements surround the first layer.
A method of manufacturing an antenna module, the method comprising:
- (a) providing a circuit layer and an antenna element on the circuit layer, the antenna element including a higher-dielectric-constant layer and a low-frequency antenna disposed on the higher-dielectric-constant layer;
- (b) forming a lower-dielectric-constant layer on the circuit layer and adjacent to the higher-dielectric-constant layer;
- and
- (c) forming a high-frequency antenna on the lower-dielectric-constant layer, wherein (a) further comprises:
- (a1) connecting the higher-dielectric-constant layer on the circuit layer by an adhesive layer.
An antenna module, comprising:
- a first layer having a first Dk;
- a second layer adjacent to the first layer, the second layer having a second Dk lower than the first Dk;
- a first antenna disposed on the first layer, the first antenna configured for operating at a first frequency;
- and
- a second antenna disposed on the second layer, the second antenna configured for operating at a second frequency higher than the first frequency, wherein the first layer includes an adhesive layer and a dielectric layer disposed between the first antenna and the adhesive layer.
An antenna module, comprising:
- a first layer having a first Dk;
- a second layer adjacent to the first layer, the second layer having a second Dk lower than the first Dk;
- a first antenna disposed on the first layer, the first antenna configured for operating at a first frequency;
- a second antenna disposed on the second layer, the second antenna configured for operating at a second frequency higher than the first frequency, wherein the second layer includes a encapsulant layer covering the first layer and a dielectric layer disposed between the second antenna and the encapsulant layer;
- and
- a plurality of feeding elements penetrating the second layer and electrically connected to the second antenna, wherein the feeding elements include a first portion penetrating the encapsulant layer and a second portion penetrating the dielectric layer.
Dependencies are inferred from the claim text.