Semiconductor package including passive device embedded therein and method of manufacturing the same

A semiconductor package comprising:

• a semiconductor chip comprising an electrode pad formed on a top surface thereof;
• a passive device embedded in the semiconductor package, wherein a functional electrode portion is formed thereon;
• a cover layer covering the semiconductor chip and the passive device and comprising at least one first opening formed therein to expose a part of the passive device;
• at least one electrode pattern formed on the cover layer to transmit an electrical signal;
• and
• at least one signal transmission segment disposed so as to be spaced apart from a side surface of the semiconductor chip or the passive device in order to transmit an electrical signal from an upper side of the semiconductor package to a lower side thereof,
• wherein the functional electrode portion is a portion of the electrode pattern, is formed on the passive device through the first opening, and is a component that is required in order for the passive device to perform the function of the passive device,
• wherein the passive device performs a function of the passive device by forming the functional electrode portion,
• wherein the cover layer covers the signal transmission segment, and further comprises at least one third opening formed therein to expose the signal transmission segment, and
• wherein the electrode pattern further comprises at least one segment connection portion connected to the signal transmission segment through the third opening.