Leadframe with ground pad cantilever
AssigneeTexas Instruments Incorporated
InventorsErnesto Pentecostes Rafael, Jr., Dolores Babaran Milo, Michael Flores Milo
Life of this patent
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Abstract
An electronic device includes a die attach pad with a set of cantilevered first leads for down bond connections, a set of second leads spaced apart from the die attach pad, a semiconductor die mounted to the die attach pad and enclosed by a package structure, a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads, and a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.
Claims20
An electronic device, comprising:
- a package structure, including a first side, a second side spaced apart from the first side along a first direction, a third side, and a fourth side spaced apart from the third side along a second direction, the first and second directions being orthogonal to one another;
- a die attach pad enclosed by the package structure, the die attach pad including a set of cantilevered first leads, respective ones of the first leads extending outward from a side of the die attach pad within the package structure;
- a set of second leads spaced apart from the die attach pad, respective ones of the second leads exposed along a corresponding one of the first, second, third, and fourth sides of the package structure;
- a semiconductor die enclosed by the package structure, the semiconductor die including a first side mounted to the die attach pad, and a second side with conductive bond pads electrically connected to a circuit or component of the semiconductor die;
- a set of first bond wires connected between respective bond pads of the semiconductor die and at least some of the first leads of the die attach pad;
- and
- a set of second bond wires connected between respective further bond pads of the semiconductor die and at least some of the second leads.
A lead frame, comprising:
- a die attach pad, including a set of cantilevered first leads, respective ones of the first leads extending outward from a side of the die attach pad;
- and
- a set of second leads spaced apart from the die attach pad.
A method, comprising:
- providing a lead frame that includes a die attach pad with a set of cantilevered first leads that extend outward from a side of the die attach pad, and a set of second leads spaced apart from the die attach pad;
- performing a die attach process that attaches a semiconductor die to the die attach pad of the lead frame;
- performing a wire bonding process that attaches a set of first bond wires between respective bond pads of the semiconductor die and at least some of the cantilevered first leads of the die attach pad, and that attaches a set of second bond wires between respective further bond pads of the semiconductor die and at least some of the second leads;
- and
- performing a molding process that encloses the semiconductor die, a portion of the die attach pad, the cantilevered first leads, first portions of the second leads, and the first and second bond wires in a package structure that exposes second portions of the second leads.
Dependencies are inferred from the claim text.