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US 11,538,767 B2Granted
Integrated circuit package with partitioning based on environmental sensitivity
AssigneeTexas Instruments Incorporated
InventorsBarry Jon Male, Paul Merle Emerson, Kurt Peter Wachtler
Life of this patent
Estimating the term…
Abstract
An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.
Claims11
An integrated circuit package, comprising:
- a lead frame;
- a first die bonded to and electrically connected to the lead frame;
- a second die electrically connected to and spaced apart from the first die;
- a silicon compound including a modulus covering the second die and in between a bottom surface of the second die and a top surface of the first die;
- and
- a molding compound covering the first die, the second die, and the silicon compound;
- the molding compound comprising an inner surface that is spaced apart from the silicon compound to form a gap between the molding compound and the silicon compound, wherein the first die includes calibration circuitry configured to provide adjustment values to the second die;
- and wherein the second die comprises trim circuitry configured to apply the adjustment values to the electronic circuit of the second die.
5 more elements
A voltage reference device, comprising:
- a lead frame;
- a first die comprising:
- a voltage reference circuit;
- and
- temperature control circuitry configured to control a temperature of the voltage reference circuit by heating the first die to a predetermined temperature;
- a second die that is larger than the first die, the second die comprising:
- circuitry configured to calibrate the voltage reference circuit;
- a first side that is bonded to the lead frame;
- and
- a second side that is opposite the first side, and is adjacent to and spaced apart from the first die;
- and
- a plurality of bond wires that electrically connect the first die to the second die.
9 more elements
Dependencies are inferred from the claim text.