Isolated transformer with integrated shield topology for reduced EMI

A packaged electronic device, comprising:

• first conductive contacts at least partially exposed to an exterior of a package structure;
• second conductive contacts at least partially exposed to the exterior of the package structure;
• a multilevel lamination structure in the package structure, the multilevel lamination structure including:
• a first patterned conductive feature having multiple turns in a first level to form a first winding coupled to at least one of the first conductive contacts in a first circuit;
• a second patterned conductive feature having multiple turns in a different level to form a second winding coupled to at least one of the second conductive contacts in a second circuit isolated from the first circuit;
• and
• a conductive shield trace having multiple turns in a second level spaced apart from and between the first patterned conductive feature and the second patterned conductive feature, the conductive shield trace coupled to the first circuit.